Please include a cover letter with your resume (in one file) describing how you would be a great fit at Photonic and what attributes you could bring to our growing team.
Key responsibilities
- Develop and implement optical packaging and assembly processes for integrated photonic devices, including high-precision active alignment to achieve optimal coupling efficiency and long-term stability
- Design, validate, and optimize alignment methods and tooling to improve accuracy, throughput, and repeatability
- Establish validation plans and characterize optical performance under relevant operating conditions
- Define scalable workflows, SOPs, and process controls to ensure consistent manufacturing outcomes
- Support New Product Introduction by partnering with design, device, test, and manufacturing teams to apply Design for Excellence methodologies like Design for Manufacturability, Design for Test, and Design for Reliability early in the development cycle.
- Develop assembly stations integrating precision motion, optical metrology, and environmental control
- Analyze assembly, process, and test data to identify yield drivers, root causes, failure mechanisms, and opportunities for improved throughput, repeatability, and stability.
- Collaborate across teams to develop robust, manufacturable packaging solutions
- Define qualification criteria and acceptance standards to support product release
Skills, knowledge and expertise
- PhD or Master’s degree in physics, applied physics, packaging engineering, electrical engineering, or other relevant discipline
- Knowledge of and hands-on-experience with integrated photonics and optics
- 3+ years of experience with photonic integrated circuit, semiconductor, optoelectronic, fiber optic, or related packaging design & qualification
- Working experience in new product introduction
- Excellent teamwork, interpersonal and written communication skills.
- Good organization, problem solving skills.
- Strong attention to detail
- Deep hands-on expertise in high-precision optical alignment and packaging for Photonic Integrated Circuits
- Proven ability to translate research-grade photonic assemblies into robust, production-ready assembly processes
- Strong experience in data-driven process optimization including analyzing large datasets to identify yield drivers, diagnose failure mechanisms, and improve process stability
- Demonstrated contribution to New Product Introduction (NPI) and experience in Design for Excellence (DfX) methodologies with focus on Design for Manufacturability (DfM), Design for Test (DfT), and Design for Reliability (DfR)
Benefits
- Work closely with some of the brightest innovators in quantum technologies to drive breakthroughs that redefine computing
- Enjoy a fast-paced and fun environment where you can try new things while solving innovative challenges every day
- Inclusive company culture that values collaboration
- Regular social events and fun activities keep our global team connected
- Competitive compensation package including base salary, stock options, and relocation assistance for global talent
- Comprehensive benefits including extended health, dental, life, long term disability, an employee assistance program, parental leave top-ups, and a flexible spending account
